• Uhlaka lwensimbi
•Amaphaneli ambozwe ekilasi 5A
•Umklamo wokubamba onelungelo lobunikazi
•Idizayini yesakhiwo sangaphakathi edidiyelwe kakhulu
• Ozibuthe bomnyango owenziwe ngokwezifiso
• PC impahla yesikhathi esisodwa hot press ukubumba: izinga lokushisa eliphezulu / low lokushisa ukumelana, ukumelana ukumelana
• Uhlaka lwensimbi nenqubo yokudweba isibambo: i-primer + upende wombala + i-varnish glaze
•Inethiwekhi yokukhiya umnyango
•Izigxivizo zeminwe ze-semiconductor
•Okufakwayo kwesikrini esithintwayo
• Uhlelo lokusebenza lokuvula umnyango lwefoni yakho
•Ikhodi yezinombolo yokuvula umnyango
•Ingathuthukiswa kabusha
•Ifanele amahhotela, amafulethi, izindlu eziqashisayo
Ukucaciswa: | |
Usayizi wokukhiya wangaphandle | 308*71*25 |
Impahla yephaneli | Ingxube ye-aluminium yekhwalithi ephezulu |
Ubuchwepheshe bomphezulu | Umjovo wamafutha + i-electrophoresis |
Faka umzimba wokukhiya | 6052,6068 |
Izidingo zokujiya komnyango | 40-110 mm |
Khiya ikhanda | Ilokhi yemishini ye-Super Class B |
Izinga lokushisa lokusebenza | -20°C-+60°C |
Imodi yenethiwekhi | I-Bluetooth,Lora,Nb-iot(khetha eyodwa kokuthathu) |
Imodi yokunikezwa kwamandla | 4 amabhethri e-alkaline |
I-alamu ye-voltage ephansi | 4.8V |
Okulindile okwamanje | 60μm |
Ukusebenza kwamanje | <200mA |
Isikhathi sokuvula | ≈1.5s |
Uhlobo lokhiye | Ukhiye wokuthinta onamandla |
Uhlobo lwekhanda lezigxivizo zeminwe | I-semiconductor(ZFM-10)<0.001%<1.0% |
I-FFR | <0.001% |
KUDE | <1.0% |
Inombolo yamaphasiwedi | Sekela amaqembu angu-150 (iphasiwedi eguquguqukayo engenamkhawulo) |
Uhlobo lwekhadi | Ikhadi le-M1 |
Inombolo yamakhadi e-IC | 200 amashidi |
Indlela yokuvula umnyango | Uhlelo lokusebenza, Ikhodi, ikhadi le-IC, ukhiye womshini |
Okunye | Tuya,TLOCK,Lora,Nb-iot(khetha eyodwa kwezine) |